AUTOMATED ASSEMBLY CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 6356
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 5151
 
 
 
F21V FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR 4106
 
 
 
G06K RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS 4194
 
 
 
F21K LIGHT SOURCES NOT OTHERWISE PROVIDED FOR238
 
 
 
F21Y INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21L, F21S and F21V, RELATING TO THE FORM OF THE LIGHT SOURCES 233
 
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192
 
 
 
F21S NON-PORTABLE LIGHTING DEVICES OR SYSTEMS THEREOF 155
 
 
 
G08B SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS 193
 
 
 
H01P WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE 159

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9897292 Solid-state lighting elements on adhesive transfer tapeMay 04, 16Feb 20, 18[F21V, H01L, F21Y, F21S, G06K]
9900992 Wire bonded electronic devices to round wireJan 09, 17Feb 20, 18[H01L, H05K]
9870529 Transponder wire bonded to round wire on adhesive tape having a water-soluble backingJan 26, 17Jan 16, 18[G06K, H05K]
9814142 Electronic devices wire bonded to substrate through an adhesive layer and method of making the sameJun 24, 15Nov 07, 17[H05K]
9781839 Attaching wire to a layer of adhesiveOct 14, 15Oct 03, 17[H05K]
9652705 RFID tag on flexible substrate arrangementFeb 21, 12May 16, 17[H01P, G06K]
9606285 LED lighting apparatus having electrically conductive sheets coupled to LEDs on an LED carrierDec 18, 14Mar 28, 17[F21V, F21Y]
9595501 Wire bonded electronic devices to round wireOct 30, 15Mar 14, 17[H01L, H05K]
9565752 Wire bonded electronic devices to round wireJun 11, 15Feb 07, 17[F21V, F21Y, F21K, H01Q, H05K]
9431363 Wire bonded IC components to round wireNov 25, 14Aug 30, 16[H01L]

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Expired/Abandoned/Withdrawn Patents

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Top Inventors for This Owner

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